BGA

封装类型

元器件封装

BGA


0.5mm 0.8mm 1.0mm 1.27mm 1.5mm uBGA SBGA CBGA Lead-Free Flip Chips CCGA

BGA and CSP

0.4mm pitch
Balls	Ball Matrix	Pitch	Size (mm)	Substrate	Tray Qty	SnPb Standard	SnAgCu Lead Free - RoHS
400	20x20	0.4mm	10mm	BT	240/250	LBGA400T.4-DC209	LBGA400T.4C-DC209
625	25x25	0.4mm	12mm	BT	189	LBGA625T.4-DC259	LBGA625T.4C-DC259
900	30x30	0.4mm	15mm	BT	126	LBGA900T.4-DC309	LBGA900T.4C-DC309
2025	45x45	0.4mm	21mm	BT	60	LBGA2025T.4-DC459D	LBGA2025T.4C-DC459D
3600	60x60	0.4mm	27mm	BT	40	LBGA3600T.4-DC609	LBGA3600T.4C-DC609
6400	80x80	0.4mm	35mm	BT	24	LBGA6400T.4-DC809	LBGA6400T.4C-DC809
10,000	100x100	0.4mm	42.5mm	BT	12	LBGA10000T.4-BUS	LBGA10000T.4C-BUS

For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: LBGA2025T.5C-DC459
Dummy Die: Add "D" to end of part number. Example: LBGA2025T.4-DC459D
Depopulated "perimeter" row versions are available instead of "full" array.

0.5mm pitch
Balls	Ball Matrix	Pitch	Size (mm)	Substrate	Tray Qty	SnPb Standard	SnAgCu Lead Free - RoHS
6	2x3	0.5mm	1.5 x 1.0mm	Si	Reel	CSP6E7A.5-DC023	CSP6E7A.5C-DC023
40	8x8 2-Row	0.5mm	5mm	BT	624	CSP40T.5-DC082	CSP40T.5C-DC082
56	10x10 2-Row	0.5mm	6mm	BT	608	CSP56T.5-DC102	CSP56T.5C-DC102
84	10x10 3-Row	0.5mm	6mm	BT	608	CSP84T.5-DC104	CSP84T.5C-DC104
84	12x12 3-Row	0.5mm	7mm	BT	476	CSP84T.5-DC123	CSP84T.5C-DC123
96	14x14 2-Row	0.5mm	8mm	Polyimide	360	fBGA96T.5-DC144	fBGA96T.5C-DC144
108	12x12 3-Row	0.5mm	7mm	BT	476	CSP108T.5-DC124	CSP108T.5C-DC124
108	14x14 3-Row	0.5mm	8mm	BT	360	CSP108T.5-DC146 Discontinued. Use CSP132	CSP108T.5C-DC146 Discontinued. Use CSP132.
132	14x14 3-Row	0.5mm	8mm	BT	360	CSP132T.5-DC145	CSP132T.5C-DC145
228	22x22 3-Row	0.5mm	12mm	FR4	198	LBGA228T.5-DC223 Discontinued Use -DC222	LBGA228T.5C-DC223 Discontinued Use -DC222
228	22x22 3-Row	0.5mm	12mm	BT	189	LBGA228T.5-DC222	LBGA228T.5C-DC222 [LBGA228T.5C-DC222B]
288	22x22 4-Row	0.5mm	12mm	BT	189	LBGA288T.5-DC221	LBGA288T.5C-DC221
484	22x22 Full	0.5mm	12mm	BT	189	LBGA484T.5-DC229A	LBGA484T.5C-DC229A [LBGA484T.5C-DC229B]
676	26x26 Full	0.5mm	15mm	BT	126	LBGA676T.5-DC269	LBGA676T.5C-DC269
900	30x30 Full	0.5mm	17mm	BT	90	LBGA900T.5-DC309	LBGA900T.5C-DC309
2025	45x45 Full	0.5mm	25mm	BT	44	LBGA2025T.5-DC459D	LBGA2025T.5C-DC459D
3600	60x60 Full	0.5mm	32.5mm	BT	24	LBGA3600T.5-DC609	LBGA3600T.5C-DC609
6400	80x80 Full	0.5mm	42.5mm	BT	12	LBGA6400T.5-DC809	LBGA6400T.5C-DC809
10,000	100x100 Full	0.5mm	52.5mm	BT	10	LBGA10000T.5-BUS	LBGA10000T.5C-BUS

For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: CSP56T.5C-DC102
Dummy Die: Add "D" to end of part number. Example: CSP56T.5-DC102D
Depopulated "perimeter" row versions are available instead of "full" array.

0.60mm ~ 0.65mm pitch
Balls	Ball Matrix	Pitch	Size (mm)	Substrate	Tray Qty	SnPb Standard	SnAgCu Lead Free - RoHS
4	2x2	0.65mm	1.0 x 0.5mm	Si	Reel	CSP4E7A.65-DC022	-
336	20x20 6-Row	0.65mm	14mm	BT	119	BGA336T.65-D	-
2025	45x45 Full	0.65mm	32.5mm	BT	24	LBGA2025T.65-DC459D	LBGA2025T.65C-DC459D
2500	50x50 Full	0.60mm	35mm	BT	24	LBGA2500T.6-DC509	LBGA2500T.6C-DC509

For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: LBGA2025T.65C-DC459
Dummy Die: Add "D" to end of part number. Example: LBGA2025T.65-DC459D
Depopulated "perimeter" row versions are available instead of "full" array.
Top of Page

0.75mm Pitch
Balls	Ball Matrix	Pitch	Size (mm)	Substrate	Tray Qty	SnPb Standard	SnAgCu Lead Free - RoHS
46	6x8 Full	0.75mm	6 x 7mm	BT	160	BGA46T.75-DC24	BGA46T.75C-DC24
48	6x8 Full	0.75mm	6 x 7mm	BT	480	BGA48T.75-6x8B	BGA48T.75C-6x8B

For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: BGA46T.75C-DC24
Dummy Die: Add "D" to end of part number. Example: BGA46T.75-DC24D
Top of Page

0.8mm pitch
Balls	Ball Matrix	Pitch	Size (mm)	Substrate	Tray Qty	SnPb Standard	SnAgCu Lead Free - RoHS
36	6x6 Full	0.8mm	6 x 6mm	BT	608	BGA36T.8-DC069	BGA36T.8C-DC069
48	6x8 Full	0.8mm	8 x 9mm	FR4	297	LBGA48T.8-DC689	LBGA48T.8C-DC689
48	6x8 Full	0.8mm	8mm	BT	80	BGA48T.8-DIE-6x8	-
49	7x7 Full	0.8mm	7mm	BT	476 429	BGA49T.8-DC077 BGA49T.8-D	-
49	7x7 Full	0.8mm	6mm	BT	429	-	BGA49T.8C-DC077 BGA49T.8C-ISO
64	8x8 Full	0.8mm	8mm	BT	319	BGA64T.8-DC089	BGA64T.8C-DC089
81	9x9 Full	0.8mm	8mm	BT	360	BGA81T.8-DC099	BGA81T.8C-DC099
84	6x15 DDR2	0.8mm	8x14mm	BT	TBA	LBGA84T.8-DC656	LBGA84T.8C-DC656
84	6x15 DDR2	0.8mm	10x12.5mm	BT	136	LBGA84T.8-DC654	LBGA84T.8C-DC654
84	6x15 DDR2	0.8mm	12x12.5mm	BT	152	LBGA84T.8-DC655	LBGA84T.8C-DC655
100	10x10 Full	0.8mm	10mm	BT	250	BGA100T.8-DC109	BGA100T.8C-DC109
100	11x11 4-Row	0.8mm	10mm	BT	184	BGA100T.8-11x11	-
112	11x11 4-Row	0.8mm	10mm	FR4	250	LBGA112T.8-DC114	LBGA112T.8C-DC114
144	12x12 Full	0.8mm	12mm	FR4	198 168	LBGA144T.8-DC128	LBGA144T.8C-DC128
144	13x13 4-Row	0.8mm	12mm	FR4	168 198	LBGA144T.8-DC134	LBGA144T.8C-DC134
208	17x17 4-Row	0.8mm	15mm	BT	126	BGA208T.8-DC170	BGA208T.8C-DC170
280	19x19 5-Row	0.8mm	17mm	FR4	90	LBGA280T.8-DC195	LBGA280T.8C-DC195
532	26x26 7-Row	0.8mm	23mm	FR4 BT	60	LBGA532T.8-DC266	LBGA532T.8C-DC266
676	26x26 Full	0.8mm	23mm	FR4 BT	60	LBGA676T.8-DC269	LBGA676T.8C-DC269
900	30x30 Full	0.8mm	27mm	BT	40	LBGA900T.8-DC309	LBGA900T.8C-DC309
1225	35x35 Full	0.8mm	31mm	BT	27	LBGA1225T.8-DC359	LBGA1225T.8C-DC359
1444	38x38 Full	0.8mm	32.5mm	BT	24	LBGA1444T.8-DC389	LBGA1444T.8C-DC389
1600	40x40 Full	0.8mm	35mm	BT	21	LBGA1600T.8-DC409	LBGA1600T.8C-DC409
2025	45x45 Full	0.8mm	40mm	BT	21	LBGA2025T.8-DC459D	LBGA2025T.8C-DC459D
2500	50x50 Full	0.8mm	42.5mm	BT	12	LBGA2500T.8-DC509	LBGA2500T.8C-DC509
3600	60x60 Full	0.8mm	50mm	BT	10	LBGA3600T.8-DC609	LBGA3600T.8C-DC609

For SnAgCu Lead Free solder balls, add "C" after the pitch. Example:BGA100T.8C-DC109
Dummy Die: Add "D" to end of part number. Example: BGA100T.8-DC109D
Depopulated "perimeter" row versions are available instead of "full" array.
Top of Page

1.0mm pitch
Balls	Ball Matrix	Pitch	Size (mm)	Substrate	Tray Qty	SnPb Standard	SnAgCu Lead Free - RoHS
81	9x9 Full	1.0mm	10mm	BT	184	BGA81T1.0-ISO	BGA81T1.0C-ISO
100	10x10 Full	1.0mm	11mm	BT	160	BGA100T1.0	-
144	12x12 Full	1.0mm	13mm	BT	160	BGA144T1.0-D LBGA144T1.0-DC128	LBGA144T1.0C-DC128
156	14x14 4-Row	1.0mm	15mm	BT	126	BGA156T1.0-DC140	BGA156T1.0C-DC140
160	14x14 4-Row 2x2 center	1.0mm	15mm	BT	126	BGA160T1.0-DC142	BGA160T1.0C-DC142
160	14x14 4-Row	1.0mm	15mm	BT	126	BGA160T1.0-DC147A	BGA160T1.0C-DC147A
192	16x16 4-Row	1.0mm	17mm	BT	90	BGA192T1.0-DC160A	BGA192T1.0C-DC160A
196	14x14 Full	1.0mm	15mm	BT	126	BGA196T1.0-DC149A	BGA196T1.0C-DC149A
208	16x16 4-Row 4x4 center	1.0mm	17mm	BT	90	BGA208T1.0-DC164A	BGA208T1.0C-DC164A
256	16x16 Full	1.0mm	17mm	BT	90	BGA256T1.0-DC169A	BGA256T1.0C-DC169A
288	22x22 4-Row	1.0mm	23mm	BT	60	BGA288T1.0-DC221	BGA288T1.0C-DC221
324	22x22 4-Row 6x6 center	1.0mm	23mm	BT	60	BGA324T1.0-DC224	BGA324T1.0C-DC224
384 (388)	26x26 4-Row 6x6 center	1.0mm	27mm	FR4	40	LBGA384T1.0-DC261	LBGA384T1.0C-DC261
388	26x26 4-Row 6x6 center	1.0mm	27mm	BT	40	BGA388T1.0-DC264 BGA388T1.0-D	BGA388T1.0C-DC264
400	20x20 Full	1.0mm	21mm	BT	60	LBGA400T1.0-DC209	LBGA400T1.0C-DC209
484	22x22 Full	1.0mm	23mm	FR4	60	LBGA484T1.0-DC229A	LBGA484T1.0C-DC229A
672	26x26 Full	1.0mm	27mm	FR4	40	eBGA672T1.0-D268D LBGA672T1.0-DC268	eBGA672T1.0C-D268D LBGA672T1.0C-DC268
676	26x26 Full	1.0mm	27mm	BT	40	BGA676T1.0-DC269	BGA676T1.0C-DC269
900	30x30 Full	1.0mm	31mm	FR4	27	eBGA900T1.0-D309D LBGA900T1.0-DC309	eBGA900T1.0C-D309D LBGA900T1.0C DC309
1156	34x34 Full	1.0mm	35mm	BT	24	BGA1156T1.0-DC349	BGA1156T1.0C-DC349
1600	40x40 Full	1.0mm	42.5mm	FR4	12	eBGA1600T1.0-D409D LBGA1600T1.0-DC409	eBGA1600T1.0C-D409D LBGA1600T1.0C-DC409
1936	44x44 Full	1.0mm	45mm	FR4	12	eBGA1936T1.0-D449D LBGA1936T1.0-DC449	eBGA1936T1.0C-D449D LBGA1936T1.0C-DC449
2500	50x50 Full	1.0mm	52.5mm	FR4	10	LBGA2500T1.0-DC509	LBGA2500T1.0C-DC509
10,000	100x100 Full	1.0mm	114mm	FR4	4	LBGA10000T1.0-BUS	LBGA10000T1.0C-BUS

For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: BGA256T1.0C-DC169A
Dummy Die: Add "D" to end of part number. Example: BGA256T1.0-DC169AD
Depopulated "perimeter" row versions are available instead of "full" array.
Top of Page

1.27mm Pitch
Balls	Ball Matrix	Pitch	Size (mm)	Substrate	Tray Qty	SnPb Standard	SnAgCu Lead Free - RoHS
119	7x17 Full	1.27mm	14 x 22mm	BT	84	BGA119T1.27-D	-
208	17x17 4-Row	1.27mm	23mm	BT	60	BGA208T1.27-DC170 BGA208T1.27-DC171	BGA208T1.27C-DC170 BGA208T1.27C-DC171
217	17x17 4-Row 3x3 center	1.27mm	23mm	BT	60	BGA217T1.27-DC172 BGA217T1.27-DC174	BGA217T1.27C-DC172 BGA217T1.27C-DC174
256	20x20 4-Row	1.27mm	27mm	BT	40	BGA256T1.27-DC200	BGA256T1.27C-DC200
256	16x16 Full	1.27mm	27mm	FR4	40	LBGA256T1.27-DC61	LBGA256T1.27C-DC61
272	20x20 4-Row 4x4 center	1.27mm	27mm	BT	40	BGA272T1.27-DC202	BGA272T1.27C-DC202

313	25x25 Staggered	1.27mm	35mm	BT	24	BGA313T1.27	BGA313T1.27C
352	26x26 4-Row	1.27mm	35mm	BT	24	BGA352T1.27-DC70	BGA352T1.27C-DC70
357	19x19 Full	1.27mm	25mm	FR4	44	LBGA357T1.27-DC73	LBGA357T1.27C-DC73
388	26x26 4-Row 6x6 center	1.27mm	35mm	BT	24	BGA388T1.27-DC72 BGA388T1.27-DC265	BGA388T1.27C-DC72 BGA388T1.27C-DC265
1225	35x35 Full	1.27mm	45mm	BT	12	eBGA1225T1.27-D359D LBGA1225T1.27-DC359	eBGA1225T1.27C-D359D LBGA1225T1.27C-DC359
6,400	80x80 Full	1.27mm	114mm	FR4	4	-	LBGA6400T1.27F-BUS LBGA6400T1.27C-BUS

For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: BGA256T1.27C-DC200
Dummy Die: Add "D" to end of part number. Example: BGA256T1.27-DC200D
Top of Page

SBGA - Thermally Enhanced 1.27mm Pitch
Balls	Ball Matrix	Pitch	Size (mm)	Substrate	Tray Qty	SnPb Standard	SnAgCu Lead Free - RoHS
256	20x20 4-Row	1.27mm	27mm	BT	40	SBGA256T1.27-DC200	SBGA256T1.27C-DC200
304	23x23 4-Row	1.27mm	31mm	BT	27	SBGA304T1.27-DC230	SBGA304T1.27C-DC230
352	26x26 4-Row	1.27mm	35mm	BT	24	SBGA352T1.27-DC70	SBGA352T1.27C-DC70
432	31x31 4-Row	1.27mm	40mm	BT	24	SBGA432T1.27-DC314	SBGA432T1.27C-DC314
480	29x29 5-Row	1.27mm	37.5mm	BT	21	SBGA480T1.27-ISO	SBGA480T1.27C-ISO
560	33x33 5-Row	1.27mm	42.5mm	BT	12	SBGA560T1.27-DC87	SBGA560T1.27C-DC87
600	35x35 5-Row	1.27mm	45mm	BT	12	SBGA600T1.27-D SBGA600T1.27-DC355	SBGA600T1.27C-DC355

For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: SBGA256T1.27C-DC200
Dummy Die: Add "D" to end of part number. Example: SBGA256T1.27-DC200D
Top of Page

PBGA - 1.5mm pitch
Balls	Ball Matrix	Pitch	Size (mm)	Substrate	Tray Qty	SnPb Standard	SnAgCu Lead Free - RoHS
169	13x13 Full	1.5mm	23mm	BT	60	BGA169T1.5-DC10	BGA169T1.5C-DC10
225	15x15 Full	1.5mm	27mm	BT	40	BGA225T1.5-DC15	BGA225T1.5C-DC15

For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: BGA169T1.5C-DC10
Dummy Die: Add "D" to end of part number. Example: BGA169T1.5-DC10D
Top of Page

CBGA - Ceramic Ball Grid Standard=Sn10=Hi Temp, L=Sn62=Low Temp, C=Sn96.5/Ag3.0/Cu0.5
Balls	Ball Matrix	Pitch	Size (mm)	Tray Qty	Bare Substrate Without Balls For CCGA	Hi-Temp SnPb Low-Temp SnPb	Lead Free Pb-Free (RoHS)
121	11x11 Full	1.27mm	15mm	119/126	CLGA121T1.27A-DC5 Pt-Ag95	CBGA121T1.27-DC5 Sn10/Pb90 CBGA121T1.27L-DC5 Sn62/Pb36/Ag2.0	CBGA121T1.27C-DC5 Sn96.5/Ag3.0/Cu0.5
196	14x14 Full	1.27mm	18.5mm	84	CLGA196T1.27A-DC11 Pt/Ag95	CBGA196T1.27-DC11 Sn10/Pb90 CBGA196T1.27L-DC11 Sn62/Pb36/Ag2.0	CBGA196T1.27C-DC11 Sn96.5/Ag3.0/Cu0.5
256	16x16 Full	1.27mm	21mm	60	CLGA256T1.27A-DC61 Pt/Ag95	CBGA256T1.27-DC61 Sn10/Pb90 CBGA256T1.27L-DC61 Sn62/Pb36/Ag2.0	CBGA256T1.27C-DC61 Sn96.5/Ag3.0/Cu0.5
304	16x19 Full	1.27mm	21 x 25	55	CLGA304T1.27A-DC63 Pt/Ag95	CBGA304T1.27-DC63 Sn10/Pb90 CBGA304T1.27L-DC63 Sn62/Pb36/Ag2.0	CBGA304T1.27C-DC63 Sn96.5/Ag3.0/Cu0.5
361	19x19 Full	1.27mm	25mm	44	CLGA361T1.27A-DC71 Pt/Ag95	CBGA361T1.27-DC71 Sn10/Pb90 CBGA361T1.27L-DC71 Sn62/Pb36/Ag2.0	CBGA361T1.27C-DC71 Sn96.5/Ag3.0/Cu0.5
400	20x20 Full	1.27mm	27mm	40	CLGA400T1.27A-DC21 Pt/Ag95	CBGA400T1.27-DC21 Sn10/Pb90 CBGA400T1.27L-DC21 Sn62/Pb36/Ag2.0	CBGA400T1.27C-DC21 Sn96.5/Ag3.0/Cu0.5
625	25x25 Full	1.27mm	32.5mm	24	CLGA625T1.27A-DC81 Pt/Ag95	CBGA625T1.27-DC81 Sn10/Pb90	CBGA625T1.27C-DC81 Sn96.5/Ag3.0/Cu0.5
1089	33x33 Full	1.27mm	42.5mm	12	CLGA1089T1.27A-DC339 Pt/Ag95	CBGA1089T1.27-DC339 Sn10/Pb90	CBGA1089T1.27C-DC339 Sn96.5/Ag3.0/Cu0.5

For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: CBGA256T1.27C-DC61
Dummy Die: Add "D" to end of part number. Example: CBGA256T1.27-DC61D
CBGA Substrate: 1.0mm (40mils) thick. Composition 96% Alumina, 4% Talc, 1600°C. Fired CTE 6.7 x 10-6/°C
Large Size CBGA Delamination CTE mismatch warning.
Top of Page


Notes About Substrates
BT Versus FR4
Flex Polyimide Versus BT