Click PC Board Number below for more details about Kit | ||
Kit Name | Main Components | PC Board Number |
QFP Tool | QFP Lead Straightening Tool | 900000 |
FC176 Flip Chip Substrate | 176 Bump Flip Chip 204µm | 901001 |
FC88 Flip Chip Substrate | 88 Bump Flip Chip 204µm | 902001 |
FC317 Flip Chip Substrate | 317 Bump Flip Chip 254µm | 903001 |
FC220 Flip Chip Substrate | 220 Bump Flip Chip 204µm | 904001 |
CBGA196 Ceramic Substrate | 4x CBGA196 1.27mm pitch | 905201 |
CBGA1089 Ceramic Substrate | 2x CBGA1089 1.27mm pitch | 905901 |
FC96 Flip Chip Ceramic Substrate | FC96 Flip Chip 457µm | 906001 |
FC96 Flip Chip Substrate | FC96 Flip Chip 457µm | 907001 |
FC48 Flip Chip Ceramic Substrate | FC48 Flip Chip 457µm | 908001 |
FC48 Flip Chip Substrate | FC48 Flip Chip 457µm | 909001 |
Beginner's Throughhole | 24 Traditonal Throughhole Components | 910001 |
FC112 Flip Chip Substrate | FC112 Flip Chip 152µm | 911001 |
Re-certification by Hand | Low Cost Mixed Technology for Re-certification | 912001 |
Multilayer Lead Free Throughhole | DIP14 Daisy Chain + Connector + Zero Ohm Resistors + Capillary PTH Test | 913001 |
Mixed Technology 2 | Fine Pitch SMD and BGA, Chips and Throughhole | 914001 |
Multipurpose Throughhole Machine Run | 200 different Throughhole components | 915001 |
Multipurpose Throughhole Hand Assembly | 200 different Throughhole components | 916001 |
BGA352-BGA400 Kit | BGA352 1.27mm & BGA400 1.5mm | 917001 |
Philips Machine Run | Large board 9"x8" 0201 chips, BGA, uBGA, Flip Chips, TQFP .3mm pitch | 919001 |
Challenger 1 | See new Challenger 2 #928001 | 920001 |
µBGA TV46 | Tessera µBGA CSP46 0.75mm pitch | 921001 |
µBGA TV74 | Tessera µBGA CSP74 Obsolete | 922001 |
µBGA TV188 | Tessera µBGA CSP188 | 923001 |
Beginners SMD | Simple Kit with PLCC, SOIC, SOT, Chips | 924001 |
SMD Introductory Kit | QFP, PLCC, SOIC, SOT, Chips | 925001 |
Practical Hand Kit | QFP, PLCC, SOIC, SOT, DIP, chips | 926001 |
Challenger 2 Kit | QFP, BGA, PLCC, SOIC, SOT, Chips | 928001 |
Jumbo Chip Kit | 0402, 0603, 0805, 1206 chips | 929001 |
Advanced SMD 1 | QFP, TQFP, TSOP | 930001 |
Advanced SMD 2 | QFP,TQFP, TSOP | 931001 |
µBGA TV62 | Tessera µBGA CSP62 RAMBUS 0.8mm/1.0mm asymetrical pitch with daisy chain | 932001 |
µBGA TV208 | Tessera µBGA CSP208 RAMBUS 0.5mm | 934001 |
Stencil Eval 0.3mm Pitch | TQFP, QFP, BGA, TSOP, PLCC | 935001 |
Stencil Eval 0.4mm Pitch | QFP, BGA, TSOP, PLCC | 936001 |
BGA256/272 Kit | BGA256/272 Pitch 1.27mm | 937001 |
Econo Kit 2 | TQFP, SO, DIP, Chips | 938001 |
Econo Kit 3 | QFP, PLCC, SO, DIP, Chips + throughhole | 939001 |
Monster Kit | See 948001 | 940001 |
0.3mm Pitch Kit | TQFP168 | 943001 |
Rework Practice 2 | QFP, PLCC, SOIC, SOT, chips | 944501 |
PCMCIA | LQFP, TSOP, Chips | 945001 |
Universal BGA 1.27/1.5mm | BGA for 1.27mm and 1.5mm pitch without daisy-chain | 946001 |
Multiple BGA | Daisy-chain Top: BGA196/256/272/352/388 Back: BGA225/352/388 | 947001T Top 947001B Back BGA Mounting |
Monster Kit 2 | Combines Advanced 930001 and Challenger 2 Kits 928001 | 948001 |
0201 / 0401 Kit | 0201 chips on top side and 0402 chips on back side of board | 949001 |
SABER Array | 4-Board array Mixed Technology designed by SMTA fine-pitch, BGA, TSOP, SIR coupon, Wave solder coupons, etc | 950001 |
Multiple CBGA | CBGA121,196,256,304,361,625 on FR-4 Board | 951001 |
LBGA209 | Memory Board BGA209 1.0mm 11x19 matrix | 952001 |
Visual Placement Inspection | Acrylic with sticky surface for BGA 1.27mm and 1.5mm pitch | 953001 |
Visual Placement Inspection | Acrylic with sticky surface for µBGA and CSP 0.5mm to 0.8mm pitch | 953101 |
Visual Placement Inspection | Acrylic with sticky surface for 0.8mm and 1.0mm BGA | 953201 |
Visual Placement Inspection | Acrylic with sticky surface for Flip Chip 204um, 254um and 457um pitch | 953401 |
Visual Placement Inspection | Acrylic with sticky surface for Flip Chip Grid Lines 4mil to 20mil | 953501 |
Visual Placement Inspection | View of Layers of Typical Visual Boards | 953xxx |
CBGA196 and CBGA625 | CBGA196/625 with daisy chain | 957001 |
BGA1225 and BGA1089 | BGA1225 & BGA1089 with daisy chain | 958001 |
Machine Diagnostic Kit | 3 Machine Diagnotic kits: Speed, Rotational & Fiducials | 960001 |
TSOP32 Kit | 9 each TSOP32 0.5mm pitch | 960301 |
Fiducial Evaluation | QFP100 with 10 different fiducial marks | 961001 |
BQFP132 | BQFP132 25 mils | 961301 |
QFP160 | QFP160 0.65mm Pitch | 961601 |
360° Rotational Placement | TSOP, SO, Chips | 961801 |
Multiple QFP 0.4mm to 0.8mm | QFP120, QFP160, QFP208, QFP256 | 962001 |
QFP208 | QFP208 0.5mm Pitch | 962101 |
QFP256 | QFP256 0.4mm Pitch | 962501 |
Universal BGA 0.5mm - 0.8mm | Universal BGA with non-daisy chain pads for 0.5mm, 0.75mm and 0.8mm pitch | 963001 |
Chip Shooter 0402 / 0603 | 0402 and 0603 Chips | 964001 |
Rework Practice 1 | QFP, PLCC, SOIC, SOT, chips | 965001 |
BGA169 / 225 Daisy Chain Test | BGA169 and BGA225 1.5mm pitch | 967001 |
Chip Shooter 0805 / 1206 | 0805 and 1206 Chips | 968001 |
Mixed Technology 1 | QFP, PLCC, SOIC, SOJ, Chips, DIP | 969601 |
SMD Bread Board | Snaps apart for Prototyping | 970500 |
Sample Display Boards for Show & Tell | Parts mounted in plastic case | 970000 |
Not used | Internal Use | 971 - 972 |
CCGA1089 - 1.27mm and CCGA1247 - 1.0mm | Column Grid Array FR4 Board | 973000 |
eBGA1600 1.0mm pitch | eBGA1600 1.0mm | 974000 |
Metcal Rework Practice Board | Rework Practice Board 3 | 977001 |
Universal BGA 1.0mm / 0.8mm | Universal BGA board for 1.0mm and 0.8mm pitch | 981001 |
Lead Free QFP208 | QFP208 with Ni-Pd leads and tin board | 982001 |
Lead Free 0805 / 1206 chips | 0805 and 1206 chips with tin terminations and tin board | 983001 |
Lead Free 0402 / 0603 chips | Lead Free 0402 and 0603 chips | 984001 |
Lead Free BGA | Top: BGA196/256/272/352/388 Back: BGA225/352/388 | 985001T Top 985001B Back |
Lead Free BGA and Fine Pitch | Lead Free BGAs, QFP, chips | 986001 |
BGA and Fine Pitch | HASL Sn/Pb version of 986001 | 987001 |
Global Fiducial Only | Global Fiducial Only 5.5" x 8" | 997001 |
Fine Pitch BGA 0.8mm / 1.0mm Pitch | fBGA672 1.0mm and BGA100 0.8mm pitch | 998101 |
BGA Substrates | Practice Substrates for BGA Semiconductor Manufacturing Equipment | BGA Substrates |